It is designed for high-precision wafer handling, die bonding, and inspection; it is compatible with a variety of wafer cassettes and baskets, operates in cleanroom environments, and enhances production throughput and positioning accuracy.
As a flexible conveying module, it enables dynamic pitch adjustment and precise positioning of tooling carriers and material trays on the production line, rapidly accommodating multi‑variety manufacturing and enhancing line flexibility.
It is applied to loading and unloading on SMT production lines, as well as FPC/PCB board positioning and testing, precisely performing alignment, insertion/removal, and sorting of multi‑specification boards and components.
Serving in vitro diagnostic equipment, pharmaceutical dispensing, and packaging, it enables sterile, precise gripping and arrayed arrangement of containers such as test tubes, reagent kits, and vials.
It is used for sorting, filling, and boxing of bottles, jars, and boxes in multiple specifications, with rapid adjustment of the gripping distance to enable flexible multi‑specification packaging on a single machine.
Used in cell stacking, module assembly, and PACK lines, it precisely controls the spacing between cells or modules, ensuring stack alignment and assembly consistency.
Integrated into machine tool loading/unloading and flexible assembly lines, it enables the automated gripping, positioning, and rapid retooling of workpieces and fixtures across multiple specifications.
It is used in precision optical platforms and biological sample-handling equipment to achieve automated, high-precision array-based positioning and transfer of sample carriers.
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