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High-precision positioning and micron-level handling provide stable and reliable automated execution components for wafer cutting, chip packaging, and test sorting.
Wafer dicing and chip mounting need to repeat positioning accuracy within ± 0.02mm, which is difficult to meet with traditional cylinders.
The encapsulated wire body CT needs to be controlled within 1 second, which puts forward extremely high requirements on the response speed and stability of the execution components.
Tiny dust and vibration may cause the chip to be scrapped, and the execution parts need to have high cleanliness and anti-vibration performance.
Based on the self-developed variable pitch module and blade cylinder, combined with clean room design standards, it provides a complete implementation scheme from single axis to multi-axis for the semiconductor front and back roads.
The crystal round box (FOUP) is fed into the workstation through the clean handling robot.
The variable pitch module extends the wafer ring from close-packed spacing to the spacing required by the process.
The blade cylinder drives the ultra-thin blade for wafer dicing with an accuracy of ± 0.02mm.
The cut chips were adsorbed by a vacuum cylinder and transferred to a test tray.
After the test is completed, the execution part will place the good and bad products in separate warehouses.
