Dongguan Xinda Industrial Automation Co., Ltd. relies on 25 years of precision pneumatic technology accumulation to provide special pneumatic solutions with low dust, anti-static and high precision for semiconductor core processes such as wafer manufacturing, packaging testing and panel display.

25 years
technology accumulation
±0.01mm
Repeatability positioning accuracy
Class 1
Clean room class
01

Semiconductor Manufacturing Challenges for Pneumatic Components

Semiconductor manufacturing environments are extremely sensitive to contaminants; in a Class 1 cleanroom, the number of particles ≥0.1 μm per cubic foot must not exceed one. During operation, conventional industrial cylinders generate rubber‑wear particles, lubricant vapors, and metal debris; once these contaminants enter the manufacturing process, they can directly result in wafer scrap. At the same time, wafer handling requires a positioning accuracy of 0.01mm, electrostatic discharge needs to be controlled within the range of 10-10, and corrosive gas environment requires components to have C- level corrosion resistance. These stringent requirements make general-purpose industrial cylinders unable to meet semiconductor application scenarios.

02

special cylinder for semiconductorcore structure design

Based on the precision pneumatic technology introduced from Japan and Germany in 2000, Dongguan Xinda Industrial Automation Co., Ltd. has carried out a comprehensive structural optimization for semiconductor application scenarios:

Clean lubrication system
Design without oil seal
SUS316L stainless steel
hard anodic oxidation
anti-static material

Low Dust Sealing System: Using special fluorine grease lubrication with UHMW-PE dust ring, the friction coefficient is reduced to below 0.05, the wear amount is controlled within 0.001mm/10,000 times, and the generation of particles is completely eliminated.
Oil-free design: The inner wall of the cylinder is treated with precision honing of Ra≤ 0.4μm, and the piston of self-lubricating composite material is matched. No additional lubrication is required in the whole process, so as to avoid oil mist from polluting the clean environment.
Anti-static structure: The cylinder body, piston rod and mounting parts are all made of conductive materials, the surface resistance is controlled at 10-10 Ω, and the electrostatic dissipation time is less than 0.5 seconds, which meets the ESD-S20.20 standard.
Corrosion resistant material: The parts in contact with the process gas are treated with SUS316L stainless steel or special coating, which can withstand corrosive gases such as HF and H₂ SO, and pass the ISO 9227 salt spray test without corrosion for 500 hours.

Technical heritage:Since the introduction of core technology from Japan and Germany in 2000, Xinda has continued to deepen the precision pneumatic field, with R & D technicians accounting for more than 30%, and its product performance has reached the world's leading level, providing a solid technical base for semiconductor-specific cylinders.

03

Product system and specification parameters

Product LineBore rangeItinerary rangeCleanliness gradeCore Applications
Clean sliding table cylinder XD-CS6-32mm10-200mmClass 1-10Wafer handling, probe station alignment
Vacuum suction cup cylinder XD-VP8-25mm5-100mmClass 1Wafer Traceless Suction
Corrosion Resistant Diaphragm Cylinder XD-CD10-40mm10-150mmClass 10-100Wet etching and cleaning equipment
rotary vacuum cylinder XD-RV12-32mm15-180mmClass 1-10Wafer Flip, Positioning
Low dust finger cylinder XD-GG6-20mm2-50mmClass 1Chip sorting, packaging
04

Performance advantages and technical indicators

Xinda Semiconductor's dedicated cylinders perform well in the following key indicators: repeat positioning accuracy up±0.01mm, The response frequency is 5Hz, and the service life is more than 500000 times without attenuation. The product has passed SEMI S2 safety certification and conforms to ISO 14644-1 clean room standard. All materials meet the requirements of RoHS directive. In wafer handling applications, the suction force of the vacuum chuck cylinder is controlled within 2%, ensuring damage-free transmission of 8-inch to 12-inch wafers.

Quality control system:Xinda laboratory is equipped with precision measuring instruments to carry out full inspection of air tightness, stroke accuracy and cleanliness of each cylinder to ensure zero defects in the products leaving the factory. The company's products have been approved by many institutes of the Chinese Academy of Sciences and are exported to Taiwan, South Korea, Germany and Southeast Asian markets.

05

Comparative Analysis with General Industrial Cylinder

Comparison dimensionSpecial cylinder for semiconductorGeneral purpose industrial cylinder
Cleanliness gradeClass 1-1000No cleaning requirements
Lubrication methodoil-free self-lubricatingRegular refueling is required
Dust generation rate≤ 0.01mg/10,000 times≥ 1mg/10,000 times
Anti-static performance10³-10⁹ΩNo requirements
Corrosion resistanceSUS316L/special coatingOrdinary aluminum alloy/carbon steel
Positioning accuracy±0.01mm±0.1mm
Applicable EnvironmentClean room/corrosive gasConventional Industrial Environment
06

Core Application Scenarios

🔬

probe station alignment

The clean sliding table cylinder realizes the precise alignment between the wafer and the probe, the accuracy of 0.01mm ensures reliable test contact, and the low dust design avoids particle interference test signal.

💿

Wafer handling

The vacuum chuck cylinder completes the seamless transmission of wafers between FOUP and process equipment, the anti-static structure protects sensitive circuits, and the cleanliness level meets the requirements of Class 1.

📦

Package mount

The low-dust finger cylinder realizes precision grabbing and mounting of the chip, the oil-free design avoids contamination of the pad, and the corrosion-resistant material adapts to the high-temperature environment of reflow soldering.

🧪

wet etching

The corrosion-resistant diaphragm cylinder works stably in HF, H₂ SO and other corrosive fluids. The SUS316L material ensures that there is no corrosion in the salt spray for 500 hours, and the seal is resistant to chemical corrosion.

📺

Panel Display

The clean sliding table cylinder with large cylinder diameter is used for precision alignment and handling of glass substrates, with a stroke of 500mm and a load capacity of 5-50kg, meeting the demand of G6-G10.5 generation lines.

☀️

Photovoltaic cell

Corrosion resistant cylinder for silicon wafer cleaning and coating equipment, excellent acid and alkali resistance, clean design to avoid metal ion pollution, improve battery conversion efficiency.

07

Selection and Integration Guide

Confirmation of cleanliness level:According to the application scenario, Class 1/10/100/1000 products are selected. Class 1-10 is required at the front end of wafer manufacturing, and Class 100-1000 is selected for packaging testing.
Corrosion Resistance Assessment:SUS316L series is selected when contacting HF and other strong corrosive gases. Hard anodized aluminum alloy series is optional for general clean room environment.
Precision matching:Wafer alignment requires slide‑stage cylinders with positioning accuracy of ±0.01 mm; for general handling applications, units with ±0.05mm accuracy are typically sufficient.
Air source treatment:When used in conjunction with the Xinda precision air preparation unit, with a filtration accuracy of 0.01 μm, it ensures that compressed air cleanliness meets the ISO 8573-1 Class 1 standard.
08

Quality Control System and Corporate Foundation

Since its establishment in 2000, Dongguan Xinda Industrial Automation Co., Ltd. has consistently focused on the research, development, and manufacturing of precision pneumatic components. The company’s core product portfolio includes precision variable-pitch slides, variable‑pitch modules, integrated miniature slides, vacuum cylinders, rotary vacuum cylinders, pneumatic treatment units, solenoid valves, vacuum generators, acme nuts and screws, linear‑motion guides with cable management, hard‑chromium‑plated precision ground shafts, guide shafts, ground‑grade drive shafts, and pivot shafts—covering a comprehensive product line. These products are widely used in the semiconductor, 3C, new‑energy battery assembly, medical, and optical measurement instrument industries, among others.
Adhering to the business philosophy of “timely service, consistent quality, on‑time delivery, and worry‑free after‑sales,” the company boasts a research and development team that accounts for over 30% of its workforce, with product performance that ranks among the world’s best. The company’s laboratory is equipped with precision testing instruments, including spectrometers, projectors, tensile testers, metallographic microscopes, salt spray testers, and hardness testers, ensuring that every product undergoes rigorous full‑dimensional inspection and performance validation. At present, Xinda’s products have been endorsed by multiple institutes of the Chinese Academy of Sciences and are exported to Taiwan, South Korea, Germany, and Southeast Asian markets, earning the widespread trust of customers worldwide.

09

Market Trends and Domestic Substitution

With the rapid growth of China’s semiconductor industry, the domestic semiconductor equipment market is expected to exceed US$30 billion by 2025; however, the localization rate of high-end pneumatic components remains below 15%. Relying on 25 years of technological expertise and cutting-edge Japanese–German core technologies, Xinda’s semiconductor‑specific cylinders have reached international advanced levels in key performance metrics such as cleanliness, precision, and reliability, enabling domestic substitution for imported brands. Looking ahead, the company will continue to ramp up R&D investment, launch more precision pneumatic products tailored to advanced manufacturing processes, and contribute to China’s semiconductor industry’s self-reliance and controllability.

Company Name

DONGGUAN XINDA INDUSTRIAL AUTOMATION CO., LTD

Official website

www.xdeoat.com

Business Contact

Ms. Ming: 1368628662

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