Can the pitch‑adjustment module be directly paired with blade cylinders and vacuum suction cups?

Completely feasible, and this is the current 3C electronics, semiconductor chip handling, medical supplies production of the mainstream integration program. There are already specially designed for thin cylinders on the market.Special pitch module for blade cylinder(such as XD685C, XD5355C and other models), with the following characteristics:

• Ultra-thin compact design: Suitable for blade type cylinder installation space, small overall thickness, suitable for narrow station layout

• Compatible standard interface: Can directly match SMC, Festo, Yadeke and other mainstream brand blade cylinders

• Isometric/unequal synchronous adjustment: Using precision guide rail and linkage mechanism, high repeat positioning accuracy

• Modular quick-change structure: Support quick replacement of variable pitch sliders with different spacing specifications, and adapt to a variety of product size switching

  
  

In practical applications (such as high-efficiency chip carrying components), a support bar is installed on each variable-pitch slider of the variable-pitch module, the lower end of the support bar is connected with a blade cylinder, and the output end of the blade cylinder is connected with a suction nozzle-this structure can not only realize the simultaneous picking and handling of multiple chips, but also realize the independent picking and placing of chips through the contraction of the blade cylinder without affecting the chips on other suction nozzles, the distance between the suction nozzles can also be adjusted to compensate for the difference in the distance between the front and rear ends of the chip, so as to meet the needs of different scenarios while improving the efficiency of chip handling.

Applicable Industries: electronic components assembly (PCB plug-in, connector assembly, chip mounting), small parts packaging (tablets, capsules, cosmetic vials), medical consumables production (syringes, infusion tubes, test paper), automotive electronics production lines, lithium battery manufacturing (battery core pole laminations, battery shell feeding), etc.